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| MOSDESIGN SEMICONDUCTOR CORP. TAIPEI : TEL : FAX : H.K. : TEL : FAX : 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 LED FLASH VDD CONTROL RGB LED IC FEATURES LED IC M1346 * Minimum external component ( without limit current resister ). * Built-in oscillator. * Power on continual function. P/N M1346-1 M1346-2 M1346-3 FUNCTION + APPLICATION * Blinking LED, Function indicator, R.G.B Mix etc.. ELECTRICAL CHARACTERISTICS Characteristics Operating Voltage Operating Current Quiescent Current Driving Current Oscillator Frequency Operating Temperature Sym. VDD IOP ISB IOL FOSC Temp. Min. 20 0 Typ. 4.5 0.1 1 110 25 Max. 5 0.5 60 Unit V mA A mA KHz ( @VDD=4.5V unless otherwise specified ) REMARKS No load One-shot mode @VDS = 1.2 V 30% TOL. APPLICATION DIAGRAM VDD=4.5V BL YGL GL RL VDD=4.5V BL YGL GL RL M1346P VSS VDD VSS VDD GL BL 1 8 RL VSS Y VDD Y 4 5 X 1.35 X 1.09 mm2 =VDD X M1346 1.35 X 1.09 mm2 =VDD X M1346 * LED Chip Material Algainp Ingan Ingan Algainp * Vf ( V ) Max. 2.1 3.5 4.0 2.3 Iv ( mcd ) At Ir ( mA) Typ. 120 100 20 80 120 Emitted color Red Green Blue Yellow Green p(nm) 635 525 470 550 Typ. 1.9 3.1 3.65 2.0 *All specs and applications shown above subject to change without prior notice. ( , ) 1/3 2004-09-02 MOSDESIGN SEMICONDUCTOR CORP. TAIPEI : TEL : FAX : H.K. : TEL : FAX : 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 LED FLASH VDD CONTROL RGB LED IC * M1346-1 ( R G YG B 1 2 3 4 5 6 7 8 9 LED IC ) M1346 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 * M1346-2 ( ) R G YG B 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 * M1346-3 ( R G YG B 1 2 3 + ) 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 2/3 2004-09-02 MOSDESIGN SEMICONDUCTOR CORP. TAIPEI : TEL : FAX : H.K. : TEL : FAX : 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 LED FLASH VDD CONTROL RGB LED IC PAD ASSIGNMENT & POSITION LED IC M1346 1 2 3 11 10 9 8 Y X (0,0) 4 5 7 6 No. 1 2 3 4 5 6 7 8 9 10 11 NAME YG GL RL VSS TEST2 TEST1 Y X OPT VDD BL X -282.80 -92.40 552.40 552.40 552.40 559.10 2.20 -552.50 -552.50 -552.50 -552.50 UNIT : um Y 423.20 423.20 423.20 243.20 -184.20 -423.20 -423.20 -264.70 -77.70 109.30 274.30 * CHIP SIZE ~ 1.35 x 1.09 mm2 * IC substrate should be connected to VDD in PCB (PCB IC VDD) 3/3 2004-09-02 |
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